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RPS-T40
RPS-SONIC
Customized Ultrasonic Soldering Machine with Temperature Control for Vacuum Glass Soldering
Description
The Customized Ultrasonic Soldering Machine with Temperature Control is a high-precision bonding system specifically designed for vacuum glass sealing and advanced material joining applications. It combines controlled heating with high-frequency ultrasonic vibration to achieve strong, clean, and reliable soldering on temperature-sensitive and difficult-to-wet materials.
Unlike conventional soldering irons that rely purely on thermal energy, this ultrasonic system actively removes oxide layers and enhances solder wetting during the joining process. This makes it especially suitable for vacuum glass applications where airtight sealing, structural stability, and long-term reliability are critical.
With an integrated temperature control system, the equipment ensures stable thermal conditions, preventing overheating or damage to delicate glass structures while maintaining optimal solder flow performance.
Technical Principles: How Does Ultrasonic Soldering "Activate" the Soldering Process?
Ultrasonic soldering iron tin plating technology cleverly combines high-frequency mechanical vibration (typically 20kHz-60kHz) with a precisely temperature-controlled soldering iron tip. Its core principle lies in the cavitation and mechanical friction effects of ultrasound:
Cavitation Cleaning: Ultrasonic waves generate countless tiny vacuum bubbles in the molten solder, which collapse instantly. The resulting powerful shock waves completely peel away the oxide film and contaminants from the surface of the workpiece (such as a metal sealing ring on glass), exposing an absolutely clean, active metal surface.
Friction Wetting: High-frequency vibrations generate microscopic friction and agitation at the solid-liquid interface, significantly reducing the surface tension and interfacial energy of the molten solder. This allows it to spread rapidly and uniformly at lower temperatures and penetrate into the micropores of the substrate, forming a dense metallurgical bond.
Low-Temperature Advantage: Because ultrasound significantly improves the fluidity and wettability of the solder, welding can be completed at temperatures 30-100°C lower than traditional methods, greatly reducing heat input.
Parameter:
| Model No. | RPS-T | |
| Ultrasonic Frequency | 40Khz | |
| Maximum Output | 800 Watt | |
| Temperature Range | 150 ~ 400 °C | |
| Power Supply | 220V / 50-60 Hz | |
| Ultrasonic Generator | Size | 250(W) x 310(L) x 135(H) mm |
| Weight | 15Kg | |
| Feature | Ultrasonic Amplitude Adjustable | |
| Pot dimension | 5*8 mm | |
| Avail Soldering Matrial | ITO Glass, AL, Mo, Cu etc., | |
A typical system consists of:
Ultrasonic Generator: The power supply that converts standard electrical power into high-frequency electrical energy.
Transducer (or Converter): Converts the high-frequency electrical signal from the generator into high-frequency mechanical vibrations.
Booster / Acoustic Horn: Modifies the amplitude of the mechanical vibrations.
Sonotrode (Soldering Tip): This is the working tip that delivers the ultrasonic vibrations to the solder and the workpiece. It can be designed as a simple iron tip or as part of a larger soldering pot.
Key Advantages
Ultrasonic-assisted soldering delivers stronger metallurgical bonding and improved sealing reliability compared to conventional thermal soldering methods.
It significantly enhances solder wetting on difficult surfaces such as glass-to-metal interfaces, reducing defects and leakage risks.
The process ensures clean, flux-reduced operation, minimizing contamination in high-vacuum or optical applications.
Compared with standard soldering irons, it provides higher precision, better repeatability, and improved structural integrity.
Temperature stability combined with ultrasonic activation prevents thermal damage while maintaining optimal bonding conditions.
Fluxless Process: Eliminates the cost of flux and, more importantly, prevents issues like corrosion and electrical leakage from flux residues. This is critical for high-reliability electronics, medical devices, and components that must remain clean.
Joins "Unsolderable" Materials: Makes it possible to solder aluminum and other difficult metals.
Excellent Wetting: The cavitation action ensures superior wetting and a strong, reliable bond.
Eco-Friendly and Safer: No harmful flux fumes are produced, creating a healthier work environment.
Vacuum glass sealing and assembly
Optical and photonic device manufacturing
Precision electronic component soldering
Sensor and vacuum instrumentation assembly
Glass-to-metal hermetic sealing
Laboratory and R&D precision joining
High-end electronic packaging applications
Advanced material bonding processes
