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20Khz Handheld Ultrasonic Tinning Machine for Sn Tinning on Al Components Industrial Tinning Gun

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20Khz Handheld Ultrasonic Tinning Machine for Sn Tinning on Al Components Industrial Tinning Gun

Ultrasonic machining is the removal of material by the abrading action of grit-loaded liquid slurry circulating between the workpiece and a tool vibrating perpendicular to the workface at afrequency above the audible range.

Frequency:	20Khz
Amplitude of vibration (a）:	30um
Application :	Tinning
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Model:
T20
Brand:
RPS-SONIC

Introduction:

Ultrasonic tinning is a kind of welding method that does not use flux. The ultrasonic probe produces cavitation in the molten solder core through mechanical vibration at ultrasonic frequency, and removes the oxide film on the metal surface for smooth and clean tinning.
Ultrasonic tinning is a flux-free connection method in which high-frequency mechanical vibration replaces flux. Ultrasonic tin furnaces of different sizes can be customized according to different welding material sizes of customers. It can also be modified on the basis of the customer's existing tin furnace, adding ultrasonic instead of flux for environmentally friendly tinning.

Parameter:

Model No.		RPS-T20
Ultrasonic Frequency		20Khz
Maximum Output		1000 Watt
Temperature Range		150 ~ 400 °C
Power Supply		220V / 50-60 Hz
Ultrasonic Generator	Size	250(W) x 310(L) x 135(H) mm
	Weight	3 Kg
	Feature	Ultrasonic Amplitude Adjustable
Pot dimension		65*8 mm
Avail Soldering Matrial		ITO Glass, AL, Mo, Cu etc.,

Ultrasonic soldering is used to join materials with either a metallurgical or mechanical bond.
A metallurgical bond is formed when the oxide from the base metal is removed through ultrasonic cavitation and implosion in the solder. The solder then comes in to contact with the base metal and the ionic attraction between the two forms a bond. A tin or lead solder bonded to copper is an example of this.

When to use Ultrasonic Soldering

There are two main reasons for using Ultrasonic Soldering:
1. To eliminate the need for flux in the soldering process
2. To apply solder to ceramics and similar materials
The advantages of removing flux from the process are that there is no need for post-process
cleaning and wicking caused by surface tension from the flux is removed. Eliminating post-process
cleaning has the obvious benefit of cost saving for both the process and the flux itself. The benefit of
eliminating wicking is that the solder coating on the base material can be better controlled.

Application

* Aluminum components
* Ferrite components
* Glass components
* Silicon wafers
* Ceramic components
* Semiconductor chips
* Metals etc.

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Ultrasonic tinning tip ULTRASONIC SOLDERING EQUIPMENT Ultrasonic tinning ultrasonic dip tinning ultrasonic sn tinning Fluxless Soldering ultrasonic Fluxless Soldering sonicator tinning ultrasonic tinning machine handheld tinning gun

METAL	MELTING POINT
METAL	(oC)	(oF)
Babbitt	249	480
Beryllium	1285	2345
Beryllium Copper	865 – 955	1587 – 1750
Bismuth	271.4	520.5
Phosphorus	44	111
Platinum	1770	3220
Red Brass	990 – 1025	1810 – 1880
Rhenium	3186	5767
Rhodium	1965	3569
Selenium	217	423
Silicon	1411	2572
Silver, Pure	961	1761
Silver, Sterling	893	1640
Carbon Steel	1425 – 1540	2600 – 2800
Stainless Steel	1510	2750
Tantalum	2980	5400
Thorium	1750	3180
Tin	232	449.4
Titanium	1670	3040
Tungsten	3400	6150
Yellow Brass	905 – 932	1660 – 1710
Zinc	419.5	787

METAL	MELTING POINT
METAL	(oC)	(oF)
Babbitt	249	480
Beryllium	1285	2345
Beryllium Copper	865 – 955	1587 – 1750
Bismuth	271.4	520.5
Phosphorus	44	111
Platinum	1770	3220
Red Brass	990 – 1025	1810 – 1880
Rhenium	3186	5767
Rhodium	1965	3569
Selenium	217	423
Silicon	1411	2572
Silver, Pure	961	1761
Silver, Sterling	893	1640
Carbon Steel	1425 – 1540	2600 – 2800
Stainless Steel	1510	2750
Tantalum	2980	5400
Thorium	1750	3180
Tin	232	449.4
Titanium	1670	3040
Tungsten	3400	6150
Yellow Brass	905 – 932	1660 – 1710
Zinc	419.5	787

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