What Is Ultrasonic Dip Soldering?

What Is Ultrasonic Dip Soldering?

Working principle and characteristics of ultrasonic tinning machine

Abstract:

Ultrasonic tinning is a process that uses the cavitation effect of ultrasound in molten tin liquid to remove the oxide layer on the metal surface immersed in the tin liquid and remove it by the sound flow, so that the tin liquid can more firmly and evenly adhere to the clean metal surface. Many metal surfaces to be welded have an oxide film, which makes welding or tinning very difficult. The traditional tinning method is to first perform surface treatment, which is complicated and costly, low in efficiency, and difficult to guarantee quality. Ultrasonic tinning solves this problem relatively easily. By introducing ultrasonic vibration into the molten tin liquid and utilizing the effect of ultrasonic cavitation effect, the purpose of high-quality tinning can be achieved.

Principle:

Ultrasonic tinning is a process that uses the cavitation effect of ultrasound in molten tin liquid to remove the oxide layer on the metal surface immersed in the tin liquid and remove it by the sound flow, so that the tin liquid can be more firmly and evenly attached to the clean metal surface. Many metal surfaces to be soldered have an oxide film, which makes welding or tinning very difficult. The traditional tinning method is to first perform surface treatment, which is complicated and costly, low in efficiency, and difficult to guarantee quality. Ultrasonic tinning solves this problem relatively easily. By introducing ultrasonic vibration into the molten tin liquid and using the effect of ultrasonic cavitation, the purpose of high-quality tinning can be achieved.

Features:

1. Green and environmentally friendly soldering solution

-No chemicals harmful to the environment and human body are discharged: no flux and flux cleaning process are required.

-No water pollution and air pollution: no flux is used during soldering, no harmful gas emissions and no industrial wastewater are generated.

2. Achieve perfect soldering

-If flux is used during soldering, tiny bubbles will be generated inside the solder. Over time, these tiny bubbles will cause cracks and other solder quality problems. However, ultrasonic soldering does not use flux for soldering. The vibration energy allows the solder to penetrate very small gaps, and no tiny bubbles will be generated inside the solder, thus achieving perfect soldering (sealing).

-Flux-free soldering-No defects in solder joints caused by strong corrosion of flux. Ultrasonic vibration allows solder to penetrate tiny gaps, and the solder joints are firm and reliable.

3. Save production costs and improve production efficiency

-No other auxiliary solder is needed during soldering, which not only saves material costs but also labor costs.

Ultrasonic soldering utilizes the shock waves and micro-jets generated by the cavitation effect in the tin liquid to disrupt and remove the oxide layer on the metal surface. This allows the tin liquid to wet the metal surface and form a uniform tin layer on it. The advantages of ultrasonic soldering are that it can be performed at room temperature, without the need for flux or cleaning agents, saving energy and materials, reducing environmental pollution, and improving product quality and reliability.

Flux-less

Ultrasonic tinning and ultrasonic soldering are flux-less welding processes that utilize ultrasonic energy to bond solder materials (such as tin) to materials like copper, aluminum, and difficult-to-solder metals without the need for chemical substances. This technique enables the soldering of sensitive components that cannot be soldered using traditional methods and offers cost savings, improved efficiency, and environmental protection.

When to use Ultrasonic Soldering

There are two main reasons for using Ultrasonic Soldering:

1. To eliminate the need for flux in the soldering process

2. To apply solder to ceramics and similar materials