  +86-15658151051                          sales@xingultrasonic.com 
Articles Detail

Ultrasonic tin plating

Views:22     Author:Site Editor     Publish Time: 2019-10-31      Origin:Site

Ultrasonic tin plating

Conventional tin plating typically uses more or less corrosive flux to remove oxide or impurities from the surface. In addition, it is impossible to solder materials such as glass, ceramic aluminum, etc. with conventional tin plating equipment. However, now our company has introduced a new ultrasonic soldering technology: using the "ultrasonic cavitation principle" to clean the oxidized surface in a simple way without the use of flux.

Acoustic waves with a frequency greater than 20 kHz are called ultrasonic waves. When the ultrasonic intensity exceeds a certain value, the interaction between the ultrasonic waves and the acoustic medium can affect, change, and destroy the state, properties, and structure of the medium.

Ultrasonic tin plating is the application of ultrasonic waves to liquid tin to produce a cavitation effect. This effect is used to destroy and remove the oxide film on the surface of the base metal, so that the liquid tin material wets the surface of the base material. The ultrasonic welding tool head is applied to a position away from the tin seam. First, the solder and the base material are heated to the soldering temperature by the heating coil, and then the ultrasonic vibration of the base material is transmitted to the base material by more than 20 kHz, the amplitude range is 0 to 100 μmm, the vibration time is between 0.5 and 10 s, and the vibration is finished. After that, the base metal is naturally cooled, and the remarkable feature of ultrasonic soldering is the low temperature tin-free agent connection. The rapid development of advanced welding technology and new soldering materials has been favored by academic and industrial circles at home and abroad as a green environmentally friendly ultrasonic soldering technology.

超声波镀锡


Applications

1.Soldering the titanium rod to the sapphire substrate;

2.Solar cell contact: silicon si single wafer, thin film solar cell, dye-sensitized solar cell;

3.The coil is wound around the glass-ceramic rod;

4.Tin plating of optical glass;

5.Welding a 120 μm glass fiber into a 0.5 mm bronze hole;

6.The copper wire is electrically contacted to the aluminum sheet of the glass substrate;

7.Contact ceramic carbon mixed superconductor with 0.8mm diameter solder joint

超神波镀锡图2

NAVIGATION

GET IN TOUCH

 Ms. Yvonne
  sales@xingultrasonic.com   
 0086-15658151051
   Room 1103B, Nature business building ,  NO.1160 GongWang Road ,FuYang, Hangzhou,Zhejiang,China

QR-CODE

© RPS-SONIC