Ultrasonic Tinning machine: An Ultrasonic Soldering Process Without The Need for Flux

What is ultrasonic tinning?

Ultrasonic tinning is a kind of welding method that does not use flux. The ultrasonic probe produces cavitation in the molten solder core through mechanical vibration at ultrasonic frequency, and removes the oxide film on the metal surface for smooth and clean tinning.

Ultrasonic tinning is a flux-free connection method in which high-frequency mechanical vibration replaces flux. Ultrasonic tin furnaces of different sizes can be customized according to different welding material sizes of customers. It can also be modified on the basis of the customer's existing tin furnace, adding ultrasonic instead of flux for environmentally friendly tinning.

This equipment does not require the use of flux and can enhance the solderability and ductility of metals. It is suitable for surface treatment needs of metal components in industries such as electronics, appliances, and automotive sectors.

The composition of ultrasonic tinning equipment

The ultrasonic tinning equipment consists of a solder pot, an electric heating temperature control device, and an ultrasonic system. The solder pot is a container that holds the tin block and heats it to melt into liquid tin. The electric heating temperature control device is a device that controls the temperature of the solder pot to maintain the optimal state of the tin liquid. The ultrasonic system generates and transmits ultrasonic waves, used to achieve ultrasonic soldering through immersion.

The ultrasonic system includes an ultrasonic generator and horn. The ultrasonic generator can adjust the power and operating mode of the ultrasonic waves. The horn is mounted at the bottom of the solder pot to transmit the ultrasonic waves into the tin liquid. When the tin liquid is melted, the ultrasonic waves are activated, creating cavitation effects in the tin liquid. This eliminates the oxide layer on the metal surface, allowing the tin liquid to wet the metal surface and form a uniform tin layer on it. By immersing the metal into the tin liquid, the ultrasonic soldering process is completed, achieving tin plating on the metal surface.

The exterior of the ultrasonic tinning equipment is enclosed in a stainless steel casing, which features corrosion resistance and high-temperature resistance. It also helps to prevent the risk of metal dust coming into contact with the ultrasonic transducer, thereby avoiding short circuits or damage to the transducer.

Ultrasonic tinning is based on the cavitation principle.

Ultrasonic soldering is a special ultrasonic welding method that utilizes the cavitation effect of ultrasonic waves. The cavitation effect refers to the vibration of tiny bubble nuclei in a liquid under the action of ultrasonic waves. When the sound pressure reaches a certain level, the bubbles rapidly expand and then suddenly collapse, generating shock waves during bubble collapse. This expansion, closure, and oscillation process create a series of dynamic phenomena. The cavitation effect can generate local high temperature, high pressure, shock waves, micro-jets, and other physical effects, exerting strong impact and stripping action on liquid and solid surfaces.

Ultrasonic soldering utilizes the shock waves and micro-jets generated by the cavitation effect in the tin liquid to disrupt and remove the oxide layer on the metal surface. This allows the tin liquid to wet the metal surface and form a uniform tin layer on it. The advantages of ultrasonic soldering are that it can be performed at room temperature, without the need for flux or cleaning agents, saving energy and materials, reducing environmental pollution, and improving product quality and reliability.

Flux-less

Ultrasonic tinning and ultrasonic soldering are flux-less welding processes that utilize ultrasonic energy to bond solder materials (such as tin) to materials like copper, aluminum, and difficult-to-solder metals without the need for chemical substances. This technique enables the soldering of sensitive components that cannot be soldered using traditional methods and offers cost savings, improved efficiency, and environmental protection.

When to use Ultrasonic Soldering

There are two main reasons for using Ultrasonic Soldering:

1. To eliminate the need for flux in the soldering process

2. To apply solder to ceramics and similar materials

The Advantages

Green and environmentally friendly: No need for flux, no generation of harmful gases or wastewater, no pollution to the environment or harm to human health.

Achieve perfect soldering: No formation of micro-bubbles inside the solder, no soldering quality issues such as cracks. No defects in the solder joints caused by flux corrosion. It allows the solder to penetrate into tiny gaps, resulting in strong and reliable solder joints.

Save production costs and improve efficiency: It enables the use of low-cost aluminum wire instead of expensive copper wire, resulting in cost savings. No pre-treatment or process related to flux is required, simplifying the soldering process and improving production efficiency.

Support the development of new materials and products: It can successfully solder difficult-to-solder materials such as copper and aluminum, contributing to the development of new materials. It is suitable for products such as solar cell glass, semiconductors, ceramic heaters, etc., supporting the development of new products.